Events: Save The Date: Tuesday, September 14th, 2010; 4:30-6:30pm, Monterey Marriott, Monterey, California, USA; The eBeam Initiative will hold its semi-annual members meeting during BACUS 2010.
>> RSVP to requests@ebeam.org
Events: D2S CEO Aki Fujimura to participate in 22 nm manufacturing panel at DAC 2010 - Panel of Experts to Discuss Design and Lithography Challenges for 22 nm Manufacturing; 47th Design Automation Conference (DAC) at the Anaheim Convention Center in Anaheim, California, USA; Tuesday, June 15 from 10:30 a.m. to 11:30 a.m. at booth #694.
Education: Best paper award at PMJ 2010 - Best depth of focus on 22nm logic wafers with less shot count; Aki Fujimura – D2S, Tadashi Komagata and Yasutoshi Nakagawa – JEOL, David Kim, Vikram Tolani and Tom Cecil – Luminescent Technologies; Photomask Japan 2010
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Education: Efficiently writing circular contacts on production reticle; Aki Fujimura – D2S, Christophe Pierrat – IC Images Technologies, Taiichi Kiuchi, Tadashi Komagata and Yasutoshi Nakagawa – JEOL; Photomask Japan 2010
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Education: Writing "wavy" metal 1 shapes on 22 nm Logic Wafers with Less Shot Count Harold R. Zable and Aki Fujimura – D2S, Tadashi Komagata and Yasutoshi Nakagawa - JEOL, John S. Petersen – Petersen Advanced Lithography; Photomask Japan 2010
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Press: eBeam Initiative Members Publish Collaborative Results at Photomask Japan 2010 – Three New Companies Join eBeam Initiative, April 13, 2010
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Events: eBeam Initiative Sponsored Coffee Breaks, April 13; eBeam Initiative member papers, April 15 - Sessions 10 and 11; Photomask Japan
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Press: eBeam Membership Grows to 27 – Initiative Introduces DFEB Mask Roadmap for High Volume Integrated Circuits, February 23, 2010
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Education: SPIE eBeam Initiative presentations – Samsung, D2S, Toppan Photomasks
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Education: Circles: One Key to Successful Lithography at Advanced Nodes by Aki Fujimura, February 23, 2010
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Press: eBeam Initiative Introduces Design for E-Beam Methodology Guidelines and Training Courses, November 9, 2009
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Education: DFEB Methodology Guidelines for Physical Design Engineers now available
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Mission | The Initiative provides a forum for educational and promotional activities regarding a new design-to-manufacturing approach, known as Design for e-beam (DFEB), that reduces mask costs for semiconductor devices.
Technology | DFEB is a design and software approach to enhance the throughput of e-beam lithographic exposure. DFEB uses character projection (CP) technology combined with design and software techniques to reduce a design's required shot count, resulting in increased CP e-beam direct-write (EbDW) throughput.
Applications | Systems companies seeking all-layer custom SoC prototypes; low-to-mid-volume semiconductor companies producing maskless test chips, engineering samples, and derivative chips; and supercomputing applications.
Design Team Advisors | Provide business and technical insights and requirements to the Steering Group and Ecosystem members.
Marty Deneroff, D. E. Shaw Research
Jack Harding, eSilicon Corporation
Colin Harris, PMC-Sierra
Riko Radojcic, Qualcomm
Jean-Pierre Geronimi, STMicroelectronics
Photomask Japan 2010: The Award Winners of Best Paper have been announced. [May 31, 2010]
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SEMICON West 2010: E-Beam Lithography Seeks Investment Boost [May 27, 2010]
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Nikkei BP: 22nm以降のLSI製造用マスクを円形ビームで描画する技術，JEOLとD2Sが実機での評価結果を発表, [April 16, 2010]
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EuroAsia Semiconductor: Three new companies join eBeam Initiative [April 13, 2010]
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Semiconductor International Newsletter: D2S and JEOL Partner to Reduce Write Times for Advanced Photomask Production [April 13, 2010]
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Industry Insights, Cadence Design Systems: Has E-Beam Lithography Finally Found Its Niche? [April 8, 2010]
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ElectroIQ: Podcasts – Aki Fujimura, President & CEO of D2S makes the case for DFEB [March 30, 2010]
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