Features

Event: eBeam Initiative reception during the Photomask Technology Conference, Monterey, Calif.; Sept. 17, 2019
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Video: Summer 2019 Edition of the Fine Line Video Journal [June 5, 2019]
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Video: Spring 2019 Edition of the Fine Line Video Journal [March 26, 2019]
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Presentation: The need for speed: Computations for EUV Lithography by Harry Levinson, HJL Lithography, at SPIE eBeam lunch [February 26, 2019]
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Presentation: How GPU-Accelerated Simulation Enables Applied Deep Learning for Photomasks by Leo Pang, D2S, at SPIE eBeam lunch [February 26, 2019]
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Presentation: Applications of Machine Learning in Computational Lithography by Yu Cao, ASML, at SPIE eBeam lunch [February 26. 2019]
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Press: ASML Joins the eBeam Initiative, Feb 26, 2019
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Event: eBeam Initiative Annual Lunch and Members Meeting at SPIE 2019, San Jose Hilton, Tuesday, February 26, 2019
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Video: Autumn 2018 Edition of the Fine Line Video Journal, October 16, 2018
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Survey: 2018 eBeam Initiative Mask Maker Survey Results [September 18, 2018]
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Survey: 2018 eBeam Initiative Perceptions Survey Results [September 18, 2018]
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Presentation: Renew, Retire, Replace by Franklin Kalk, Toppan Photomasks, at BACUS eBeam Reception [September 18, 2018]
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About Us

Mission | The Initiative provides a forum for educational and promotional activities regarding new design-to-manufacturing approaches that help reduce mask costs for semiconductor devices based on electron beam (eBeam) technologies.


Design Team Advisors | Provide business and technical insights and requirements to the Steering Group and Ecosystem members.


eBeam Member Videos | Proof points, viewpoints and products discussed by eBeam Initiative members.



D2S modeling expert Ryan Pearman examines the effects of curvilinear mask data on wafer variability and explains why curvilinear features are needed for EUV lithography.


Dr. Harry Levinson of HJL Lithography presents the need for faster computations to deal with the complex physics of leading-edge chip making with EUV lithography


Aki Fujimura, CEO of D2S, recaps the hot topics from the Photomask Japan Conference; also in Japanese


Leo Pang, Chief Product Officer at D2S, reflects on Photomask Japan in Chinese


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eBeam Industry News

Semiconductor Engineering: EUV Mask Gaps and Issues [May 8, 2019]
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Semiconductor Engineering: Single vs Multi-Patterning EUV [March 25, 2019]
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Semiconductor Engineering: EUV mask readiness challenges [March 21, 2019]
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Semiconductor Engineering: ASML Joins the eBeam Initiative, IMS presents SPIE-AL paper on the next generation MBMW-201 [March 1, 2019]
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Solid State Technology: ASML Joins the eBeam Initiative [February 26, 2019]
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tsmc.com: TSMC Recognizes Outstanding Suppliers at Supply Chain Management Forum [December 6, 2018]
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Semiconductor Engineering: Multi-Beam Mask Writing Finally Comes Of Age [November 15, 2018]
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