The eBeam Initiative

Features

Event: eBeam Initiative reception during the Photomask Technology Conference, Monterey, Calif.; Sept. 17, 2019
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Video: Spring 2019 Edition of the Fine Line Video Journal [March 26, 2019]
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Presentation: The need for speed: Computations for EUV Lithography by Harry Levinson, HJL Lithography, at SPIE eBeam lunch [February 26, 2019]
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Presentation: How GPU-Accelerated Simulation Enables Applied Deep Learning for Photomasks by Leo Pang, D2S, at SPIE eBeam lunch [February 26, 2019]
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Presentation: Applications of Machine Learning in Computational Lithography by Yu Cao, ASML, at SPIE eBeam lunch [February 26. 2019]
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Press: ASML Joins the eBeam Initiative, Feb 26, 2019
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Event: eBeam Initiative Annual Lunch and Members Meeting at SPIE 2019, San Jose Hilton, Tuesday, February 26, 2019
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Video: Autumn 2018 Edition of the Fine Line Video Journal, October 16, 2018
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Survey: 2018 eBeam Initiative Mask Maker Survey Results [September 18, 2018]
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Survey: 2018 eBeam Initiative Perceptions Survey Results [September 18, 2018]
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Presentation: Renew, Retire, Replace by Franklin Kalk, Toppan Photomasks, at BACUS eBeam Reception [September 18, 2018]
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About Us

Mission | The Initiative provides a forum for educational and promotional activities regarding new design-to-manufacturing approaches that help reduce mask costs for semiconductor devices based on electron beam (eBeam) technologies.

Design Team Advisors | Provide business and technical insights and requirements to the Steering Group and Ecosystem members.

eBeam Member Videos | Proof points, viewpoints and products discussed by eBeam Initiative members.

From the eBeam Initiative luncheon event at SPIE, Yu Cao of ASML explores applications of machine learning in computational lithography	Aki Fujimura, CEO of D2S, provides his takeaways from SPIE-AL and an update on the Center for Deep Learning in Electronics Manufacturing (CDLe); also in Japanese
Jan Willis sits down with Harry Levinson to talk about his new ventures in lithography as well as what’s driving the increase in computation time for EUV	Leo Pang, chief product officer of D2S, describes how GPU-accelerated simulation can enable deep learning for both mask and wafer manufacturing; also in Chinese
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eBeam Industry News

Semiconductor Engineering: EUV Mask Gaps and Issues [May 8, 2019]
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Semiconductor Engineering: Single vs Multi-Patterning EUV [March 25, 2019]
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Semiconductor Engineering: EUV mask readiness challenges [March 21, 2019]
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Semiconductor Engineering: ASML Joins the eBeam Initiative, IMS presents SPIE-AL paper on the next generation MBMW-201 [March 1, 2019]
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Solid State Technology: ASML Joins the eBeam Initiative [February 26, 2019]
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tsmc.com: TSMC Recognizes Outstanding Suppliers at Supply Chain Management Forum [December 6, 2018]
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Semiconductor Engineering: Multi-Beam Mask Writing Finally Comes Of Age [November 15, 2018]
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