News Archive

Semiconductor Engineering: What happened to next-gen lithography? [September 3, 2014]
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Semiconductor Engineering: One-on-one with Linyong Pang: A behind the scenes look at inverse lithography, M&A activity and next-generation lithography [May 12, 2014]
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Semiconductor Engineering: Stopping Mask Hotspots Before They Escape The Mask Shop – by Aki Fujimura, D2S CEO [April 28, 2014]
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Semiconductor Engineering: One-on-One with Naoya Hayashi — Dai Nippon Photomask’s research fellow talks about rising challenges for the photomask industry. What happens when it takes 50 hours to write a mask? [March 20, 2014]
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Semiconductor Engineering: Directed Self-Assembly Gains Momentum [March 20, 2014]
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Semiconductor Engineering: In a video interview, D2S CEO Aki Fujimura talks about the growing problems of shrinking features and what it means for lithography and photomasks [February 19, 2014]
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Semiconductor Engineering: Laurent Pain, CEA-Leti’s lithography lab manager, talks about what’s possible in lithography, what’s likely, and when it’s going to happen. [December 12, 2013]
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Semiconductor Engineering: Multi-Beam Begins to Shine [October 17, 2013]
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Semiconductor Engineering: Executive Briefing with Dr. David Lam - Getting Direct on Litho [October 17, 2013]
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Semiconductor Engineering: Debate Heats Up Over Bigger Glass [October 17, 2013]
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Semiconductor Engineering: Why does EUV matter? By Brian Bailey [October 1, 2013]
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Semiconductor Engineering: Mask Data Prep Issues Compounding at 20nm [September 19, 2013]
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Semiconductor Engineering: Litho Roadmap Remains Cloudy by Mark LaPedus [September 19, 2013]
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AZoNano.com: D2S Extends Partnership with NuFlare to Accelerate Deployment of eBeam Technologies [September 11, 2013]
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ElectroIQ: Multibeam technology predicted for use in advanced photomask production by 2016, says survey [September 9, 2013]
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Nanowerk.com: IMS Nanofabrication Announces Partnership with JEOL for the Realization of Alpha and Beta Electron Multi-Beam Mask Writer Tools [September 3, 2013]
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EE Times: Lam Eyes Next $1B Opportunity [July 8, 2013]
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SemiMD: Inside Leti’s Litho Lab [May 16, 2013]
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Thomasdalejay.blogspot.com: The Strategic Positioning of Electron Beam Lithography – The Pellicle Brief [May 15, 2013]
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SemiMD: Reaching for the Reset Button in Lithography [March 21, 2013]
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Chip Design Magazine: EUV and eBeam at SPIE ADV Litho 2013 [February 28, 2013]
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AZoNano.com: New Electron Beam Lithography System from Advantest for 1Xnm Technology Nodes [November 15, 2012]
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SemiMD: [Part 1] Experts at the Table – Issues in Lithography by Mark LaPedus [November 2012]
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SemiMD: [Part 2] Experts at the Table – Issues in Lithography by Mark LaPedus [November 2012]
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SemiMD: [Part 3] Experts at the Table – Issues in Lithography by Mark LaPedus [November 2012]
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EE Journal: Dogboning the Dogbones by Bryon Moyer [October 29, 2012]
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SemiMD: Beam me up by Mark LaPedus [October 18, 2012]
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weSRCH: Mask writing technology at 20nm and below ....Video interview with G. Dan Hutcheson and Aki Fujimura; login=requests@ebeam.org, password=ebeam2012 [October 18, 2012]
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Chip Design: D2S launches eBeam Mask Data Prep System by Pallab Chatterjee [September 22, 2012]
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SemiMD: A Mischievous Muse by Marc David Levenson [September 20, 2012]
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TechOn!: (article is in Japanese) Moving Beyond 20 nm, D2S Develops a Mask Data Generation System---ILT Mask Write Times Cut by 30% by Ikutaro Kojima [September 12, 2012]
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SemiMD: Will EUV Miss Another Node? [September 2012]
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EE Times: D2S tips model-based mask data prep tool [September 11, 2012]
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Solid State Technology: Understanding shape-dependent mask CD uniformity [September 2012]
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Future Fab: [Issue 42] E-Beam Direct Write on 300 mm Wafers: Maskless Patterning for Various Applications [July 5, 2012]
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Future Fab: [Issue 42] E-Beam Lithography Revisited [July 5, 2012]
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TechOn!: [PMJ 2012] HOYAとGLOBALFOUNDRIES、オーバラップや円形ショットのマスク露光の効果を報告 –Ikutaro Kojima [April 25, 2012]
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Solid State Technology: Electron-beam lithography breakthroughs at Photomask Japan [April 16, 2012]
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SPIE Newsroom: Model-based mask data preparation enables complex masks [April 3, 2012]
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SPIE Newsroom: Video - Competitors work together to advance eBeam technology for advanced lithography [March 16, 2012]
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BACUS News: eMET POC: realization of a proof-of-concept 50 keV electron multibeam mask exposure tool - Elmar Platzgummer, Christof Klein, Hans Loeschner, IMS Nanofabrication [February 2012]
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SemiMD: ML2 Lithography - One Tool to Write Them All - Marc D. Levenson [February 21, 2012]
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EETimes: eBeam Initiative ready with updated roadmap [February 13, 2012]
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ElectroIQ: Mask-wafer double simulation: A new lithography requirement at 22nm [December 30, 2011]
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SemiMD: E-beam Costs to Soar in Multi-Patterning Era – Mark LaPedus [October 22, 2011]
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SST WaferNews: SPIE BACUS: Better 20nm litho, and where’s the EUV funding? Having your cake and eating it, too [October 11, 2011]
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SemiMD: BACUS Panel Considers Model-based Data Prep – Marc David Levenson [October 7, 2011]
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ElectroIQ: SPIE BACUS: Delayed Photomask Japan 2011 in a nutshell – Franklin Kalk [September 21, 2011]
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GSA Forum: The Lithography Gap Widens at the 20nm Logic Node: New eBeam Approaches Required to Complete the Design Chain [September 2011]
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EETimes: eBeam Initiative expands membership [September 12, 2011]
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ElectroIQ: Model-based mask data prep using overlapping shots for 20nm devices [August 16, 2011]
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Future Fab International: The Need for Multiple Alternatives for sub-20nm Lithography, Moshe Preil - GlobalFoundries [July 7, 2011]
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EE Times: MIT scientists claim 9-nm e-beam resolution [July 4, 2011]
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ElectroIQ: Lithography cost-of-ownership considerations, David K. Lam – Multibeam Corporation [June 27, 2011]
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Future Fab International: All Lithography Roads Ahead Lead to More E-Beam Innovation [April 27, 2011 Issue 37]
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Solid State Technology: Model-based mask data prep: Solving the impossible mask [March 10, 2011]
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Semiconductor Manufacturing & Design: EbDW may sneak in behind masks [March 5, 2011]
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TechOn!: <SPIE> Acceleration Expected in EB Direct Writer Development, Nanoimprint Technology for Development of Next Generation Devices [March 4, 2011]
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TechOn!: NuFlare Technology and D2S Partner to Reduce Write Times for LSI Mask Writer [March 2, 2011]
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EE Times: D2S, NuFlare ink e-beam deal [March 1, 2011]
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LithoVision 2011: Status of Masks – Current Status and Issues for ArF Extension, Nobuhito Toyama, DNP [February 27, 2011]
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Solid State Technology: The future of lithography – Kurt Ronse (imec), Bryan Rice (Sematech), Nick Stacey (Molecular Imprints), Bruno La Fontaine (Cymer) and Aki Fujimura (D2S and eBeam Initiative) [ February 2011]
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ebeam.org: Three Industry Leaders Track Lithography Trends for 2011 [January 24, 2011]
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EE Times: Vistec to expand e-beam capabilities [October 19,2010]
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EE Times: The horror of 80-hour photomask write times [September 23, 2010]
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Solid State Technology WaferNews Podcast: More from BACUS: D2S’s Fujimura: Making the “impossible” photomask possible [September 21, 2010]
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EE Times: E-Beam: Ecosystem investment grows, but more needed [September 20, 2010]
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Chip Design Magazine Blog (Pallab’s Place): D2S and eBeam Initiative – available for std machines [September 19, 2010]
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MySemiconDaily: E-Beam Direct-Write Lithography: Does It Have the Support It Deserves? [September 15, 2010]
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Betablog: E-Beam Initiative speeds mask making [September 14, 2010]
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Photomask Japan 2010: The Award Winners of Best Paper have been announced. [May 31, 2010]
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SEMICON West 2010: E-Beam Lithography Seeks Investment Boost [May 27, 2010]
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Nikkei BP: 22nm以降のLSI製造用マスクを円形ビームで描画する技術,JEOLとD2Sが実機での評価結果を発表, [April 16, 2010]
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EuroAsia Semiconductor: Three new companies join eBeam Initiative [April 13, 2010]
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Semiconductor International Newsletter: D2S and JEOL Partner to Reduce Write Times for Advanced Photomask Production [April 13, 2010]
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Industry Insights, Cadence Design Systems: Has E-Beam Lithography Finally Found Its Niche? [April 8, 2010]
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ElectroIQ: Podcasts – Aki Fujimura, President & CEO of D2S makes the case for DFEB [March 30, 2010]
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EDN: The eBeam Initiative could slash mask costs at 22nm [February 23, 2010]
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EE Times: GlobalFoundries, Samsung join e-beam group [February 23, 2010]
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Nikkei BP: : 2010年2月26日 「【SPIE】 22nm以降のopcパターンは円形ビームで描画すべき、D2Sが提案」
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DigiTime: More industry leaders push e-beam technology [February 24, 2010]
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Solid State Technology: Making E-beam direct write faster [November 19, 2009]
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Nikkei BP: 「EB直描のスループットを1ケタ向上」,D2Sらが新手法 を開発 [October 2, 2009]
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EE Times: D2S, Advantest speed up e-beam lithography [October 2, 2009]
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EE Times Europe: German startup joins e-beam initiative [Sept 16, 2009]
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GSA Forum: Test Chip Collaboration Validates That Virtually Maskless SOCs Are Now Practical [September 2009]
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EE Times Europe: Leti receives Mapper 300-mm e-beam lithography platform [July 21, 2009]
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EDN: Fragmentation threatens the roadmap for advanced lithography [July 17, 2009]
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Nikkei BP: 富士通マイクロらが65nmチップで効果を実証,EB直描向けLSI設計環境 [May 27, 2009]
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Semiconductor Fabtech: Design for e-beam methodology validated for 65-nm SOC apps, say eBeam Initiative collaborators [May 27, 2009]
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EE Times: 65-nm test chip said to validate design-for-e-beam [May 26, 2009]
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EE Times: Design-for-ebeam firm closes $9 million in funding [Apr. 2, 2009]
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Nikkei Microdevices: Interview - Lowering the threshold of developing advanced LSIs; approved by Nikkei Microdevices [April 2009]
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BetaSights: eBeam Initiative and Tool Competition [Mar. 4, 2009]
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EDN: Heard at SPIE: direct-write e-beam production inches closer [Feb. 26, 2009]
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Semiconductor International: New Collaboration Aims to Accelerate Direct-Write E-Beam Adoption [Feb. 25, 2009]
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EE Times: Initiative forms around e-beam direct write [Feb. 24, 2009]
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Semiconductor International: E-Beam Technology Breaks Through Complex Design Cycles [Feb. 1, 2009]
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Semiconductor International: Executive Outlook: Survival and Opportunities in 2009 [Jan. 1, 2009]
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BetaSights: CEA/Leti, Vistec, and D2S push EbDW [Jan. 26, 2009]
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EE Times: Firms to collaborate on e-beam direct write [Jan. 12, 2009]
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EDN: D2S replicates direct-write e-beam scheme in Europe, moves to 45 and 32 nm [Jan. 12, 2009]
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EDN: Announcement by D2S completes the picture for Fujitsu maskless e-Shuttle [Oct. 8, 2008]
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GSA Forum: Enabling the Long Tail of SOCs [Sep. 2008]
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SCD Source: Startup preps e-beam lithography for SoCs and ASICs [Oct. 17, 2007]
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EE Times: Fujitsu, Advantest form e-beam venture [Sep. 15, 2006]
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EB直描の実力を引き出す設計を可能に [Feb. 11, 2007]
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EE Times: E-beam litho ready to rise again, says Vistec [Apr. 6, 2006]
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EE Times: Startup Multibeam enters maskless lithography race [Jan. 7, 2005]
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Semiconductor International: Mapper Demos Massively Parallel E-Beam Lithography [Sep. 13, 2007]
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