News Archive

Photomask Japan 2010: The Award Winners of Best Paper have been announced. [May 31, 2010]
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SEMICON West 2010: E-Beam Lithography Seeks Investment Boost [May 27, 2010]
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Nikkei BP: 22nm以降のLSI製造用マスクを円形ビームで描画する技術,JEOLとD2Sが実機での評価結果を発表, [April 16, 2010]
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EuroAsia Semiconductor: Three new companies join eBeam Initiative [April 13, 2010]
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Semiconductor International Newsletter: D2S and JEOL Partner to Reduce Write Times for Advanced Photomask Production [April 13, 2010]
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Industry Insights, Cadence Design Systems: Has E-Beam Lithography Finally Found Its Niche? [April 8, 2010]
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ElectroIQ: Podcasts – Aki Fujimura, President & CEO of D2S makes the case for DFEB [March 30, 2010]
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EDN: The eBeam Initiative could slash mask costs at 22nm [February 23, 2010]
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EE Times: GlobalFoundries, Samsung join e-beam group [February 23, 2010]
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Nikkei BP: : 2010年2月26日 「【SPIE】 22nm以降のopcパターンは円形ビームで描画すべき、D2Sが提案」
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DigiTime: More industry leaders push e-beam technology [February 24, 2010]
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Solid State Technology: Making E-beam direct write faster [November 19, 2009]
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Nikkei BP: 「EB直描のスループットを1ケタ向上」,D2Sらが新手法 を開発 [October 2, 2009]
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EE Times: D2S, Advantest speed up e-beam lithography [October 2, 2009]
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EE Times Europe: German startup joins e-beam initiative [Sept 16, 2009]
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GSA Forum: Test Chip Collaboration Validates That Virtually Maskless SOCs Are Now Practical [September 2009]
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EE Times Europe: Leti receives Mapper 300-mm e-beam lithography platform [July 21, 2009]
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EDN: Fragmentation threatens the roadmap for advanced lithography [July 17, 2009]
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Nikkei BP: 富士通マイクロらが65nmチップで効果を実証,EB直描向けLSI設計環境 [May 27, 2009]
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Semiconductor Fabtech: Design for e-beam methodology validated for 65-nm SOC apps, say eBeam Initiative collaborators [May 27, 2009]
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EE Times: 65-nm test chip said to validate design-for-e-beam [May 26, 2009]
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EE Times: Design-for-ebeam firm closes $9 million in funding [Apr. 2, 2009]
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Nikkei Microdevices: Interview - Lowering the threshold of developing advanced LSIs; approved by Nikkei Microdevices [April 2009]
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BetaSights: eBeam Initiative and Tool Competition [Mar. 4, 2009]
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EDN: Heard at SPIE: direct-write e-beam production inches closer [Feb. 26, 2009]
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Semiconductor International: New Collaboration Aims to Accelerate Direct-Write E-Beam Adoption [Feb. 25, 2009]
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EE Times: Initiative forms around e-beam direct write [Feb. 24, 2009]
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Semiconductor International: E-Beam Technology Breaks Through Complex Design Cycles [Feb. 1, 2009]
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Semiconductor International: Executive Outlook: Survival and Opportunities in 2009 [Jan. 1, 2009]
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BetaSights: CEA/Leti, Vistec, and D2S push EbDW [Jan. 26, 2009]
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EE Times: Firms to collaborate on e-beam direct write [Jan. 12, 2009]
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EDN: D2S replicates direct-write e-beam scheme in Europe, moves to 45 and 32 nm [Jan. 12, 2009]
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EDN: Announcement by D2S completes the picture for Fujitsu maskless e-Shuttle [Oct. 8, 2008]
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GSA Forum: Enabling the Long Tail of SOCs [Sep. 2008]
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SCD Source: Startup preps e-beam lithography for SoCs and ASICs [Oct. 17, 2007]
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EE Times: Fujitsu, Advantest form e-beam venture [Sep. 15, 2006]
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EB直描の実力を引き出す設計を可能に [Feb. 11, 2007]
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EE Times: E-beam litho ready to rise again, says Vistec [Apr. 6, 2006]
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EE Times: Startup Multibeam enters maskless lithography race [Jan. 7, 2005]
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Semiconductor International: Mapper Demos Massively Parallel E-Beam Lithography [Sep. 13, 2007]
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