
Presentations and Papers:
HOYA, GLOBALFOUNDRIES and D2S presentations at eBeam Initiative Luncheon during PMJ2012 [April 19, 2012]
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Shape-Dependent Mask CD Uniformity Impacts Tradeoffs in Design Rules and Wafer Quality at 20-nm and Below by Aki Fujimura, D2S [April 19, 2012]
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eBeam Initiative SPIE 2012 presentations by D2S, Tela Innovations in collaboration with CEA-Leti [February 14, 2012]
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MB-MDP Enables Circular Shots to Improve Mask Accuracy as Well as Shot Count by Ryan Pearman and Robert Pack - D2S, Inc. [February 13, 2012]
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eBeam Initiative BACUS event presentations by AMTC, D2S and GLOBALFOUNDRIES, including Best Poster presentation by Dr. Gek Soon Chua, GLOBALFOUNDRIES [September 20, 2011]
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BACUS 2011 Paper - Reducing shot count through optimization-based fracture, Timothy Lin, Emile Sahouria, Nataraj Akkiraju, and Steffen Schulze. Proc. SPIE 8166, 81660T (2011) [October 13, 2011]
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BACUS 2011 Poster Session - Assessment and comparison of different approaches for mask write time reduction, A. Elayat, T. Lin, E. Sahouria, and S. F. Schulze, Proc. SPIE 8166, 816634 (2011) [October 13, 2011]
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BACUS 2011 Best Poster - Optimization of mask shot count using MB-MDP and lithography simulation by GLOBALFOUNDRIES and D2S [September 20, 2011]
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SPIE 2011 Model-Based Mask Data Prep (MB-MDP) and its effect on heating [March 2, 2011]
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IBM presentation at eBeam Initiative SPIE lunch [March 1, 2011]
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NuFlare presentation at eBeam Initiative SPIE Lunch [March 1, 2011]
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D2S presentation at eBeam Initiative SPIE Lunch [March 1, 2011]
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SPIE 2011 E-beam Direct Write Overview [March 1, 2011]
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SPIE 2011 IMAGINE: An Open Consortium to Boost Maskless Lithography Take Off - First Assessment Results on Mapper Technology [March 2011]
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Model-Based Mask Data Preparation Using Overlapping Shots: Making Optical Lithography Cost-effective for 20-nm Devices [March 1, 2011]
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Improvement of Mask Write Time for Curvilinear Assist Features at 22nm [September 14, 2010]
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Writing 32nm-hp Contacts with Curvilinear Assist Features [September 14, 2010]
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Impact of Model-Based Fracturing on E-beam Proximity Effect Correction Methodology [September 14, 2010]
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Design for e-beam: design insights for direct-write maskless lithography [September 15, 2010]
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Best paper award at PMJ 2010 - Best depth of focus on 22nm logic wafers with less shot count; Aki Fujimura - D2S, Tadashi Komagata and Yasutoshi Nakagawa - JEOL, David Kim, Vikram Tolani and Tom Cecil - Luminescent Technologies; Photomask Japan 2010
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Efficiently writing circular contacts on production reticle; Aki Fujimura - D2S, Christophe Pierrat - IC Images Technologies, Taiichi Kiuchi, Tadashi Komagata and Yasutoshi Nakagawa - JEOL; Photomask Japan 2010
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Writing "wavy" metal 1 shapes on 22 nm Logic Wafers with Less Shot Count Harold R. Zable and Aki Fujimura - D2S, Tadashi Komagata and Yasutoshi Nakagawa - JEOL, John S. Petersen - Petersen Advanced Lithography; Photomask Japan 2010
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ISQED Keynote now available - Design for E-Beam: Getting the Best Wafers Without the Exploding Mask Costs by Aki Fujimura, March 24, 2010
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Circles: One Key to Successful Lithography at Advanced Nodes by Aki Fujimura, February 23, 2010
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DFEB Methodology Guidelines for Physical Design Engineers now available
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ICCAD Tutorial now available - Beyond Light: The Growing Importance of E-Beam by Aki Fujimura, Nov. 2, 2009
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eBeam members presentation at EIPBN - May 29, 2009
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eBeam members presentation at MUSIC - April 2, 2009
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DFEB Technology Backgrounder
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Initiative Overview
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Fujitsu Viewpoint at Initiative Launch
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eSilicon Perspective on DFEB
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