Features

Events: PMJ 2017 April 5 14:50-16:10 Session 3 Use of GPU in Mask Making (I); 16:30-18:00 Session 4 Use of GPU in Mask Making (II)
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Events: PMJ 2017 Invited Talk April 5: “eBeam Initiative Survey Reports Confidence in EUV and Multi-beam Technology” Presenter: Aki Fujimura (eBeam Initiative)
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Videos: Spring 2017 Edition of the Fine Line Video Journal, March 22, 2017
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Presentation: The Resurgence of ILT by Tom Cecil, Synopsys, presented at eBeam Initiative SPIE 2017 Lunch, February 28, 2017
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Presentation: Mask Modeling in the Multi-beam Era by Ryan Pearman, D2S, presented at eBeam Initiative SPIE 2017 Lunch, February 28, 2017
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Presentation: eBeam at Light Speed for the EPE Metrology Era by Ofer Adan, Applied Materials, presented at eBeam Initiative SPIE 2017 Lunch, February 28, 2017
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Press: SMIC Joins the eBeam Initiative as EUV Lithography and Multi-Beam Mask Writing Become Key Themes for 2017, February 28, 2017
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About Us

Mission | The Initiative provides a forum for educational and promotional activities regarding new design-to-manufacturing approaches that help reduce mask costs for semiconductor devices based on electron beam (eBeam) technologies.


Design Team Advisors | Provide business and technical insights and requirements to the Steering Group and Ecosystem members.


eBeam Member Videos | Proof points, viewpoints and products discussed by eBeam Initiative members.



Tom Cecil of Synopsys discusses the resurgence of inverse lithography technology (ILT), including future opportunities for supporting directed self-assembly (DSA) and EUV


Greg McIntyre of imec offers his thoughts on what's driving up confidence in EUV and the latest on imec's joint venture with JSR in EUV resist development


Aki Fujimura, CEO of D2S, looks back at SPIE-AL and forward to PMJ 2017; also in Japanese also in Japanese


Leo Pang, chief product officer of D2S, also recaps these developments, including CSTIC, in Chinese


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eBeam Industry News

Semiconductor Engineering: Experts at the Table Part 1 - EUV’s viability still in doubt even as rollout begins by Mark LaPedus [March 16, 2017]
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Semiconductor Engineering: China - Fab Boom or Bust? [March 16, 2017]
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Silicon Semiconductor: SMIC Joins eBeam Initiative [March 1, 2017]
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Semiconductor Engineering: Changes Ahead in Patterning – Ed Sperling interviews Aki Fujimura [February 22, 2017]
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Businesswire: IMS and JEOL Partner to Provide World’s First Production Multi-Beam Mask Writer [February 16, 2017]
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Semiconductor Engineering: Inside Photomask Writing [January 19, 2017]
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Semiconductor Engineering: Multi-Patterning Issues at 7nm, 5nm [November 28, 2016]
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