Features

Press: eBeam Initiative Survey Reports Confidence in EUV Lithography and Multi-beam Technology for High-Volume Semiconductor and Photomask Production, September 12, 2016
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Survey: 2016 eBeam Initiative Mask Maker Survey Results, September 12, 2016
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Survey: 2016 eBeam Initiative Perceptions Survey Results, September 12, 2016
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Presentation: Embedding IoT Chip Security using eBeam Solutions by Dr. David Lam, Multibeam Corporation, September 12, 2016
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White Paper: GPU-Accelerated Computing: Maximizing Performance for the 24/7 Semiconductor Manufacturing Environment by Aki Fujimura, D2S, September 12, 2016
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Events: Save the Date for the annual eBeam Initiative Reception at BACUS including survey results, Monday, September 12 with registration starting at 5:30pm at the Hilton San Jose Convention Center
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Presentation: Introduction and Recent Results of Multi-beam Mask Writer MBM-1000 by Hiroshi Matsumoto, NuFlare at Taiwan Seminar on June 22, 2016
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Presentation: Maglen eBeam Wafer Imaging System by Tony Luo, Maglen at Taiwan Seminar on June 22, 2016
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Presentation: The Latest Progress in Model-based Mask Data Prep by Leo Pang, D2S at Taiwan Seminar on June 22, 2016
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Videos: Summer 2016 Edition of the Fine Line Video Journal, May 24, 2016
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About Us

Mission | The Initiative provides a forum for educational and promotional activities regarding new design-to-manufacturing approaches that help reduce mask costs for semiconductor devices based on electron beam (eBeam) technologies.


Design Team Advisors | Provide business and technical insights and requirements to the Steering Group and Ecosystem members.


eBeam Member Videos | Proof points, viewpoints and products discussed by eBeam Initiative members.



Aki Fujimura shares his viewpoint on how all lithography paths lead to multi-beam mask writing


Naoya Hayashi of DNP examines both challenges and progress with nanoimprint lithography (NIL) master templates


Aki Fujimura, CEO of D2S, recaps the emerging lithography trends presented at Photomask Japan and the agenda for the upcoming eBeam Initiative Taiwan seminar in June


Leo Pang, chief product officer of D2S, also reviews these developments—in Chinese—including highlights of the recent China Semiconductor Technology International Conference


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eBeam Industry News

Semiconductor Engineering: Speeding Up Mask Production [September 13, 2016]
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SemiMD: Applied Materials Intros High Res eBeam Inspection System [July 2016]
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Semiconductor Engineering: Combo inspection tool [July 2016]
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Semiconductor Engineering: Securing Chips During Manufacturing – Can Directed Electron Writing Change the Security Equation? Dr. David Lam [July 7, 2016]
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Semiconductor Engineering: Executive Insight – Aki Fujimura [June 23, 2016]
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GSA Forum: Reducing IC Manufacturing Cost While Enhancing IoT Security by Dr. David Lam [June 2016]
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Semiconductor Engineering: What’s the Outlook for ICs? By Mark LaPedus [May 19, 2016]
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