Survey: 2026 eBeam Initiative Luminaries Survey Results [September 9, 2026]
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Presentation: Photomask Ecosystem – Current Status and Issues, Naoya Hayashi, DNP Honorary Fellow [September 9, 2026]
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Press: eBeam Initiative Survey Predicts a Bright Outlook for the Photomask Industry [September 9, 2026]
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Videos: Breaking news from SPIE BACUS workshop on Large Format Masks [September 7, 2026]
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Event: [Note it’s on a Wednesday] eBeam Initiative Reception during SPIE Photomask Technology + EUV Conference, Monterey, Calif.; Wednesday Sept. 9, 2026
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Videos: Summer 2026 Fine Line Video Journal [June 11, 2026]
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Videos: Spring 2026 Fine Line Video Journal [March 25, 2026]
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Presentation: Only Entirely Curvilinear Masks are Entirely Manufacturable Masks, Aki Fujimura, D2S [February 24, 2026]
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Survey: 2026 Deep Learning/LLM Applications List by eBeam Initiative members [February 24, 2026]
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Event: eBeam Initiative SPIE-AL Annual Lunch and Members Meeting, Tuesday, February 24, 2026
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Videos: Autumn 2025 Fine Line Video Journal [November 5, 2025]
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Survey: 2025 eBeam Initiative Luminaries Survey Results [September 23, 2025]
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Presentation: Technology Analysis of Leading-Edge Semiconductor Manufacturing, Tetsuya Wadaki, Morgan Stanley MUFG [September 23, 2025]
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Event: eBeam Initiative Reception during SPIE Photomask Technology + EUV Conference, Monterey, Calif.; 5:00–7:15pm Sept. 23, 2025
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Mission | The Initiative provides a forum for educational and promotional activities regarding a new design-to-manufacturing approach, known as Design for e-beam (DFEB), that reduces mask costs for semiconductor devices.
Technology | DFEB is a design and software approach to enhance the throughput of e-beam lithographic exposure. DFEB uses character projection (CP) technology combined with design and software techniques to reduce a design's required shot count, resulting in increased CP e-beam direct-write (EbDW) throughput.
Applications | Systems companies seeking all-layer custom SoC prototypes; low-to-mid-volume semiconductor companies producing maskless test chips, engineering samples, and derivative chips; and supercomputing applications.
Design Team Advisors | Provide business and technical insights and requirements to the Steering Group and Ecosystem members.
Marty Deneroff, D. E. Shaw Research
Jack Harding, eSilicon Corporation
Colin Harris, PMC-Sierra
Riko Radojcic, Qualcomm
Jean-Pierre Geronimi, STMicroelectronics
EE Times: Intel Puts High-NA EUV into Production, but Stitching Still Has Something to Prove
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Semiecosystem: Mask Makers Upbeat, New Mask Size Gains Steam by Mark LaPedus
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Semiconductor Engineering: News from this week’s SPIE Photomask Technology + Extreme Ultraviolet Lithography Conference
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Business Insider: ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
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Semiecosystem: Multibeam Debuts Next-Gen E-Beam Lithography Tool by Mark LaPedus [July 23, 2026]
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Semiconductor Engineering: Mask Economics Shape High-NA EUV Adoption [June 22, 2026]
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Semiecosystem: Latest News in Lithography by Mark LaPedus [June 7, 2026]
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